Mumbai, December 18, 2024: RRP Electronics Limited, a leading player in the semiconductor industry, has announced the signing of Memorandum of Understanding (MoU) with AMB, Taiwan. The collaboration aims to spearhead the production of advanced Memory Modules including SPI NAND, MICROSD, EMMC, and SSD technologies. This strategic partnership is projected to generate $25 million in annual revenue and marks a significant milestone in the global semiconductor ecosystem.
The agreement encompasses comprehensive technology sharing, including package structure details, substrate designs, test program development, and tool design support. With extended capacities starting from 2GB onwards, the new memory solutions will cater to increasing demand in the global electronics market.
Speaking on this landmark collaboration, Rajendra Chodankar, Chairman of RRP Electronics Limited said, “RRP Electronics is thrilled to partner with AMB, Taiwan. Through this association, we will deploy cutting-edge technology at our state-of-the-art OSAT facility, ensuring our products are ready to serve leading corporate giants like Samsung and other major players. This collaboration sets the stage for delivering $25 million in revenue annually and further positions us as a global leader in semiconductor innovation.”
The production will take place at RRP Electronics’ 40,000 sq. ft. OSAT (Outsourced Semiconductor Assembly and Test) facility located in Mahape, which became operational in September 2024. To meet growing demand, the company is also expanding its manufacturing footprint with new production lines at its upcoming plant at MIDC, Taloja, expected to commence operations within the next two years.